US Patent Issued to City University of Hong Kong on Sept. 22 for "Multi-component high entropy alloy with nanoscale atomic self-ordering structure and preparation methods thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,230, issued on Sept. 22, was assigned to City University of Hong Kong (Hong Kong, Hong Kong).

"Multi-component high entropy alloy with nanoscale atomic self-ordering structure and preparation methods thereof" was invented by Tao Yang (Hong Kong, Hong Kong) and Jiang Ju (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention uses additive manufacturing technology to develop a new L12 reinforced multi-component high entropy alloy, which has high density and excellent strength and ductility mechanical properties. The selective laser melting process employed in crafting these multi-component high entropy alloys render...