US Patent Issued to City University of Hong Kong on June 30 for "Composition for manufacture of hydrogel material, hydrogel material, method of manufacture of hydrogel material, method of manufacture of hydrogel structure, and method of using device including hydrogel material" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,670, issued on June 30, was assigned to City University of Hong Kong (Kowloon Tong, Hong Kong).

"Composition for manufacture of hydrogel material, hydrogel material, method of manufacture of hydrogel material, method of manufacture of hydrogel structure, and method of using device including hydrogel material" was invented by Peng Shi (Hong Kong, Hong Kong), Jin Qu (Hong Kong, Hong Kong) and Kai Xie (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present invention is concerned with a composition for the manufacture of a hydrogel material. The composition has N-(3-Sulfopropyl)-N-methacroyloxyethyl-N,N-dimethylamm...