US Patent Issued to CISCO TECHNOLOGY on Nov. 3 for "Via ground structures" (Chinese, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,745, issued on Nov. 3, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.).

"Via ground structures" was invented by Wenbin Ma (Shanghai), Mike Sapozhnikov (San Jose, Calif.), Weiying Ding (Shanghai), David Nozadze (San Jose, Calif.) and Yinxin Yang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some aspects, the techniques described herein relate to an apparatus including: a semiconductor device substrate material; a first signal conductor incorporated into the semiconductor device substrate material; a second signal conductor incorporated into the semiconductor device substrate material; and a ground conductor incorporated into the...