US Patent Issued to CISCO TECHNOLOGY on April 14 for "Via and pad arrangement for printed circuit board" (Chinese, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,400, issued on April 14, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.).

"Via and pad arrangement for printed circuit board" was invented by Mike Sapozhnikov (San Jose, Calif.), David Nozadze (San Jose, Calif.), Joel Richard Goergen (Soulsbyville, Calif.), Wenbin Ma (Shanghai), Upen Reddy Kareti (Union City, Calif.) and Weiying Ding (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, an apparatus, includes a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB and a via formed through the pad. The via is offset from a center of the pad such that a distance bet...