US Patent Issued to Ciena on Nov. 3 for "Photonic chiplet packaging" (New Jersey, New York, California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,785,817, issued on Nov. 3, was assigned to Ciena Corp. (Fulton, Md.).

"Photonic chiplet packaging" was invented by Peter Johannes Winzer (Aberdeen, N.J.), Brett Michael Dunn Sawyer (Pasadena, Calif.), Guilhem de Valicourt (Jersey City, N.J.), Jonathan Proesel (Mount Vernon, N.Y.) and Marco Lamponi (Aberdeen, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system includes a first chiplet, a second chiplet, an electronic amplification module, and a converter module. The first chiplet includes, e.g., a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence a...