US Patent Issued to Ciena on May 19 for "Adaptive chassis design accommodating multi form factor pluggable modules in network applications" (Indian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,100, issued on May 19, was assigned to Ciena Corp. (Hanover, Md.).

"Adaptive chassis design accommodating multi form factor pluggable modules in network applications" was invented by Chander Prakash Gupta (Gurugram, India), Sachin Singla (Gurugram, India), Suyash Agrawal (Gurugram, India) and Karan Goel (Gurugram, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chassis design and methodology providing for the use of multiple power supply unit and other module form factors without chassis redesign. This increases usable life and future upgradability (in terms of power, for example) for network platforms. The chassis design utilizes a power supp...