US Patent Issued to Ciena on July 28 for "Method for placing a chip for device manufacturing" (Canadian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,398, issued on July 28, was assigned to Ciena Corp. (Hanover, Md.).

"Method for placing a chip for device manufacturing" was invented by Raphael Beaupre-Laflamme (Quebec, Canada), Simon Savard (Quebec, Canada) and Jean-Sebastien Cote (Quebec, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one aspect, in general, a method for placing a chip for device manufacturing comprises: picking up the chip with a component placement tool comprises a tool surface; spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising b...