US Patent Issued to Ciena on July 28 for "Managing semiconductor wafer and die handling" (Canadian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,727, issued on July 28, was assigned to Ciena Corp. (Hanover, Md.).

"Managing semiconductor wafer and die handling" was invented by Martin Caron (Quebec, Canada), Raphael Beaupre-Laflamme (Quebec, Canada) and Simon Savard (Quebec, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for securing a semiconductor wafer portion (SWP) comprises: a first rotatable structure (RS) configured to perform a first rotation and a first counterrotation about a first axis; a second RS configured to perform a second rotation and a second counterrotation about a second axis; a first set of one or more adjustable adhesive regions (AARs) located on the ...