US Patent Issued to Ciena on April 7 for "Managing adhesive material shaping using structure arrays" (Canadian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,596,225, issued on April 7, was assigned to Ciena Corp. (Hanover, Md.).

"Managing adhesive material shaping using structure arrays" was invented by Raphael Beaupre-Laflamme (Quebec, Canada), Nicolas Boyer (Magog, Canada), Francois Pelletier (Quebec, Canada), Simon Savard (Quebec, Canada), Veronique Jomphe Allain (Quebec, Canada) and Luc Belanger (Quebec, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "An article of manufacture comprises: at least a portion of a wafer comprising a substrate and one or more layers fabricated on the substrate; one or more integrated photonic structures in the portion of the wafer, where at least a first integrated ph...