ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,994, issued on March 31, was assigned to CHUNGHWA PRECISION TEST TECH. Co. LTD. (Taoyuan City, Taiwan).
"Cantilever probe card device and solder receiving probe" was invented by Hao-Yen Cheng (Taoyuan City, Taiwan), Rong-Yang Lai (Taoyuan City, Taiwan), Chao-Hui Tseng (New Taipei City, Taiwan) and Wei-Jhih Su (Taichung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder receiving probe includes an arm segment, a main segment located at one side of the arm segment, and a testing segment connected to another side of the arm segment. The main segment has a soldering end portion and an extending end portion respectively located at two ...