US Patent Issued to CHIPBOND TECHNOLOGY on March 24 for "Flip chip bonding method and chip used therein" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,541, issued on March 24, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Flip chip bonding method and chip used therein" was invented by Fei-Jain Wu (Hsinchu County, Taiwan), Sheng-Jen Wu (Hsinchu County, Taiwan) and Hsueh-Shun Yeh (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a bonding process of a flip chip bonding method, a chip is bonded to contact pads of a substrate by composite bumps which each includes a raiser, a UBM layer and a bonding layer. Before the bonding process, the surface of the bonding layer facing toward the substrate is referred to as a surface to be bonded. During the bonding process...