ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,564, issued on Aug. 11, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).
"Flexible circuit board" was invented by Ting-Yi Kuo (Kaohsiung City, Taiwan), Yi-Ling Hsieh (Kaohsiung City, Taiwan) and Chiu-Hung Lai (Kaohsiung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible circuit board includes a flexible substrate, circuit lines, a solder resist layer and shaping strips. The flexible substrate has a first part and a second part which is wider than the first part and easy to be bent. The circuit lines are arranged on the flexible substrate and covered by the solder resist layer. The shaping strips are arranged on the so...