US Patent Issued to CHINA UNIONPAY on Sept. 15 for "SDK repair method and apparatus, terminal, device, system, and medium" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,179, issued on Sept. 15, was assigned to CHINA UNIONPAY Co. LTD. (Shanghai).

"SDK repair method and apparatus, terminal, device, system, and medium" was invented by Wenchuan Wu (Shanghai), Ji Xia (Shanghai), Xi Shen (Shanghai), Zhixiong Tang (Shanghai) and Qiang Liu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure describes an SDK repair method and apparatus, a terminal, a device, a system, and a medium. The method includes obtaining SDK information, host information and SDK anomaly information of different anomaly types; determining an anomaly impact index corresponding to each anomaly type of a target SDK according to the S...