ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,004, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China).
"Semiconductor package" was invented by Xiaofei Sun (Hefei City, China) and Changhao Quan (Hefei City, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first base plate, first semiconductor structure, second base plate and filling layer. The first base plate has a first surface including first and second signal transmission regions. The first semiconductor structure located on the first surface is electrically connected to the first signal transmission region. The second base plate located on the first base plate incl...