US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on June 23 for "Package structure and packaging method" (Chinese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,014, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China).

"Package structure and packaging method" was invented by Xiaoxuan Chen (Hefei City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes at least two semiconductor structures that are stacked onto one another. The first surface of one semiconductor structure of the at least two semiconductor structures that are stacked onto one another directly faces toward the second surface of another semiconductor structure of the at least two semiconductor structures which is adjacent to said one semiconductor structure; the first metal lay...