US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on June 16 for "Semiconductor package assembly and manufacturing method" (Chinese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,692, issued on June 16, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Semiconductor package assembly and manufacturing method" was invented by Xiaofei Sun (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly and a manufacturing method are provided. The semiconductor package assembly includes: a base plate having a first surface; a first chip structure located on the base plate and electrically connected to the first surface of the base plate; an intermediary layer having a first interconnection surface; and a molding compound. The first interconnection surface has a first and second inter...