US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 28 for "Three-dimensional stack package structure with adhesive layers" (Chinese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,817, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China).

"Three-dimensional stack package structure with adhesive layers" was invented by Hongkai Ji (Hefei City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed three-dimensional stacked package structure includes: a packaging substrate, having a substrate body, connecting leads, a through-hole penetrating the substrate body, a first pad and a second pad on opposite surfaces of the substrate body. The stacked structure on the first surface of the substrate body includes a second storage block, and a first storage block above the second storage block...