US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Aug. 11 for "Semiconductor package structure and method for fabricating the same" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,040, issued on Aug. 11, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China).

"Semiconductor package structure and method for fabricating the same" was invented by Mingxing Zuo (Hefei City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a first package structure and a second package structure. The first package structure includes a chip stacking structure and a molding compound. A first conductive block is disposed on the chip stacking structure. The molding compound wraps the chip stacking structure and exposes the first conductive block. The second package structure is disposed on t...