ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,735, issued on July 14, was assigned to CHAMP TECH OPTICAL (FOSHAN) Corp. (Foshan, China) and Foxconn Technology Co. Ltd. (New Taipei, Taiwan).

"Heat dissipation mechanism and electronic device having the same" was invented by Meng Fu (Foshan, China) and Jin-Rong Xie (Foshan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation mechanism comprises a carrier assembly, a heat dissipation assembly, and a buckle assembly, the carrier assembly comprises a base configured for assembling an electronic component with a heat-conductive adhesive sheet attached; the heat dissipation assembly comprises a top plate and a crimping unit, the top...