ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,982, issued on Sept. 15, was assigned to CelLink Corp. (San Carlos, Calif.).
"Methods of forming interconnect circuits methods" was invented by Kevin Michael Coakley (Belmont, Calif.), Malcolm Parker Brown (Mountain View, Calif.), Dongao Yang (Redwood City, Calif.), Michael Lawrence Miller (San Mateo, Calif.) and Paul Henry Lego (Woodside, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a flexible interconnect circuit is described. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also r...