US Patent Issued to Celestial AI on March 3 for "Via formed using a partial plug that stops before a substrate" (California Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,809, issued on March 3, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Via formed using a partial plug that stops before a substrate" was invented by Ankur Aggarwal (Pleasanton, Calif.) and Jeremy Matthew Plunkett (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method is described. The method includes creating a partial through-substrate via (TSV) plug in a front side of a wafer, the partial TSV having a front side and a back side. The back side of the partial TSV extending toward a front side of a substrate but not into a bulk of the substrate. A cavity is etched in a back side of the wafer that exposes the partial TSV...