US Patent Issued to Celestial AI on July 21 for "Via formed in a wafer using a front-side and a back-side process" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,438, issued on July 21, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Via formed in a wafer using a front-side and a back-side process" was invented by Ankur Aggarwal (Pleasanton, Calif.) and Jeremy Matthew Plunkett (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "One embodiment is a method including forming a partial through-substrate via (TSV) plug in a front side of a wafer, the partial TSV plug having a front side, a back side, and a body with a variable dimension in the body so that a largest dimension is at the back side of partial TSV plug. A cavity is etched in a back side of the wafer that exposes the back side o...