US Patent Issued to Canon on Sept. 22 for "Wafer dicing method and liquid ejection head" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,581, issued on Sept. 22, was assigned to Canon K.K. (Tokyo).

"Wafer dicing method and liquid ejection head" was invented by Takashi Teragaki (Kanagawa, Japan) and Tetsuro Yasukawa (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One embodiment of the present disclosure is a stealth dicing method performed on a wafer having a first substrate, a second substrate, and a hollow portion, the second substrate being thinner than the first substrate in a region defining the hollow portion. The stealth dicing method has a first step of performing laser application on the second substrate to form a modified region in the second substrate and a se...