US Patent Issued to CANON on March 31 for "System including an array of bonding heads and an array of die transfer seats and a method of using the same" (Texas Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,655, issued on March 31, was assigned to CANON K.K. (Tokyo).

"System including an array of bonding heads and an array of die transfer seats and a method of using the same" was invented by Byung-Jin Choi (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system can include a substrate chuck, an array of M bonding heads, an array of N*M die transfer seats, and a carriage. The substrate chuck and the array of N*M die transfer seats can be positioned along the carriage. Each of N and M can be greater than 1. A method of using the system can include transferring a first set of dies from the array of N*M die transfer seats to the array of M ...