ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,043, issued on July 14, was assigned to CANON K.K. (Tokyo).
"Bonding apparatus, bonding method and article manufacturing method" was invented by Kai Takahashi (Tochigi, Japan) and Kenichiro Mori (Tochigi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus for bonding a second object to a first object, including a holding unit configured to hold a sheet with the second object stuck thereto, a protrusion mechanism configured to protrude the second object to a side of the first object via the sheet held by the holding unit, a measurement unit configured to measure, with respect to the first object, a position of the second object ...