US Patent Issued to Canon on Feb. 24 for "Substrate joint body, method of manufacturing the substrate joint body, and liquid ejection head" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,897, issued on Feb. 24, was assigned to Canon K.K. (Tokyo).

"Substrate joint body, method of manufacturing the substrate joint body, and liquid ejection head" was invented by Keiji Watanabe (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate joint body includes a first substrate that has a first surface and a second surface facing away from the first surface and has an opening in the second surface, and a second substrate joined to the second surface with an adhesive agent, and the opening is covered with the second substrate, wherein a recessed portion extending from a position exposed to the opening toward a position facing...