US Patent Issued to Canon on Aug. 4 for "Substrate processing method and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,951, issued on Aug. 4, was assigned to Canon K.K. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Shinichi Shudo (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A processing method for a substrate processing apparatus including a chamber in which a heating plate configured to heat a substrate placed on the heating plate is located including heating the heating plate to a first temperature, cooling the heating plate to a second temperature from the first temperature, supplying dry gas into the chamber during the heating and the cooling, and carrying in the substrate onto the heating plate after ...