US Patent Issued to CANON on Aug. 18 for "Bonding apparatus, bonding method, estimation method, and article manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,880, issued on Aug. 18, was assigned to CANON K.K. (Tokyo).

"Bonding apparatus, bonding method, estimation method, and article manufacturing method" was invented by Issei Funayoshi (Tochigi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a bonding apparatus for bonding, to a first member including a first bonding surface on which a first pattern is provided, a second member including a second bonding surface on which a second pattern is provided, comprising: a first image capturing device configured to capture an image of the first bonding surface; a second image capturing device configured to capture an image of...