ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,933, issued on April 21, was assigned to Canon K.K. (Tokyo).
"Method for manufacturing substrate bonded body and method for manufacturing liquid ejection substrate" was invented by Tetsushi Ishikawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for manufacturing a substrate bonded body in which a first substrate and a second substrate are bonded together, the first substrate forming a first portion of an element, and the second substrate forming a second portion of the element, including: a film-forming step of forming an inorganic film on a bonding face of the first substrate, the bonding face facing the second substra...