US Patent Issued to Canon on April 14 for "Method for manufacturing liquid ejection chip and liquid ejection chip" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,131, issued on April 14, was assigned to Canon K.K. (Tokyo).

"Method for manufacturing liquid ejection chip and liquid ejection chip" was invented by Koji Kitani (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique capable of ensuring a sealing property between channels even with downsizing is to be provided. A method for manufacturing a liquid ejection chip equipped with an ejection unit which is configured to be capable of ejecting a plurality of liquids, and a plurality of channels which are configured to separately store the plurality of liquids to be supplied to the ejection unit, includes: filling a molten resin into a mold into ...