ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,507, issued on March 24, was assigned to CAES SYSTEMS LLC (Arlington, Va.).
"Impingement cooling in high power package" was invented by Chul Hong Park (Blue Bell, Pa.), David Allan Gauche (Bethlehem, Pa.) and Jack Melloy (Doylestown, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "This application is directed to cooling a semiconductor system. The semiconductor system includes a device substrate having a first surface and a second surface, an electronic component thermally coupled to the device substrate, and a cooling substrate coupled to the device substrate. The cooling substrate includes a third surface facing the second surface of the devic...