US Patent Issued to BROTHER KOGYO on July 14 for "Head module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,088, issued on July 14, was assigned to BROTHER KOGYO K.K. (Nagoya, Japan).

"Head module" was invented by Itsuki Morimoto (Inazawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A head module includes: a head chip having a nozzle plate and an IC; a cooler which is in thermal contact with the IC and which is configured to cool the IC; and a supplying device fluidly connected to the head chip and configured to supply ink to the head chip. In a first direction orthogonal to the nozzle plate, the cooler and the supplying device are positioned on one side with respect to the nozzle plate, the cooler and the supplying device are overlapped as seen ...