ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,814, issued on Aug. 4, was assigned to BROTHER KOGYO K.K. (Nagoya, Japan).
"Head module" was invented by Itsuki Morimoto (Inazawa, Japan) and Yuki Kawamura (Nisshin, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A head module includes: a head chip having an actuator, a channel member having a channel deformable by the actuator, and a support made of metal and supporting the channel member, a heater assembly; and a heat conductor. The heat conductor has a first contacting part in thermal contact with the support, and a second contacting part in thermal contact with the heater assembly and the actuator."
The patent was filed on March 20, 2024, ...