US Patent Issued to BONDTECH on Aug. 25 for "Chip bonding system and chip bonding method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,104, issued on Aug. 25, was assigned to BONDTECH Co. LTD. (Kyoto, Japan).

"Chip bonding system and chip bonding method" was invented by Akira Yamauchi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip bonding system (1) includes a dicing device (20) to, by dicing a dicing substrate stuck on a sheet (TE), generate a plurality of chips (CP) stuck on the sheet (TE) with chips (CP) adjacent to each other joined to each other via remaining uncut portions, an activation treatment device (60) to activate bonding surfaces of respective ones of the chips (CP) stuck to the sheet (TE), a sheet stretching device (40) to, by stretching the shee...