US Patent Issued to BOE TECHNOLOGY GROUP on Sept. 22 for "Light emitting chip and manufacturing method for the same, and light emitting device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,497, issued on Sept. 22, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Light emitting chip and manufacturing method for the same, and light emitting device" was invented by Shuang Sun (Beijing), Fangzhen Zhang (Beijing), Xinxing Wang (Beijing), Jing Niu (Beijing), Tingting Zhou (Beijing), Wei Wang (Beijing) and Yanan Niu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a light emitting chip, a manufacturing method for the same, and a light emitting device, relating to the field of display technology. The light emitting chip includes a substrate and a plurality of light emitting units arranged in a...