US Patent Issued to BOE Technology Group on March 31 for "Haptic feedback substrate and haptic feedback apparatus" (Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,309, issued on March 31, was assigned to BOE Technology Group Co. Ltd. (Beijing).

"Haptic feedback substrate and haptic feedback apparatus" was invented by Dexing Qi (Beijing), Yuju Chen (Beijing), Hui Hua (Beijing) and Yingzi Wang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provides are a haptic feedback substrate and apparatus. The haptic feedback substrate includes: a base substrate; a first electrode layer, the first electrode layer is electrically connected to a ground voltage input end; a piezoelectric film layer at one side of the first electrode layer facing away from the base substrate; a second electrode layer at one side of t...