US Patent Issued to BOE Technology Group on July 28 for "Semiconductor substrate manufacturing method and semiconductor substrate" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,490, issued on July 28, was assigned to BOE Technology Group Co. Ltd. (Beijing).

"Semiconductor substrate manufacturing method and semiconductor substrate" was invented by Jie Huang (Beijing), Ce Ning (Beijing), Zhengliang Li (Beijing), Hehe Hu (Beijing), Jiayu He (Beijing), Nianqi Yao (Beijing), Kun Zhao (Beijing), Feng Qu (Beijing) and Xiaochun Xu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate manufacturing method and a semiconductor substrate. The manufacturing method includes: forming a first semiconductor layer on the base substrate at a first temperature with a first oxide semiconductor material; forming the ...