US Patent Issued to BERKENHOFF on May 26 for "Wire electrode for wirecut electrical discharge machining with carbonaceous surface layer and the preparation methods thereof" (Chinese, German Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,721, issued on May 26, was assigned to BERKENHOFF GMBH (Heuchelheim, Germany).

"Wire electrode for wirecut electrical discharge machining with carbonaceous surface layer and the preparation methods thereof" was invented by Huogen Lin (Ningbo, China), Xianqui Meng (Ningbo, China), Tong Wu (Ningbo, China), Meijun Hu (Ningbo, China), Hongfang Gu (Ningbo, China), Yibo Chen (Ningbo, China), Zhining Liang (Ningbo, China) and Tobias Nothe (Herborn, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire electrode for wirecut electrical discharge machining (WEDM) having a carbonaceous surface layer is disclosed. The wire electrode can include a core ma...