ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,556,857, issued on Feb. 17, was assigned to BEIJING HONOR DEVICE Co. LTD. (Beijing).
"Speaker module and headset" was invented by Jinhua Liu (Beijing), Jianfei Chu (Beijing), Yunhai Li (Beijing) and Chuanguo Wang (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "A speaker module and a headset (100) are provided. The speaker module is used for the headset (100). The headset (100) includes a housing (1). The speaker module includes a first speaker unit (4a) and a second speaker unit (4b). An outer surface of a first diaphragm assembly (4a21) of the first speaker unit (4a) faces a first side, the second speaker unit (4b) is located on one side of a c...