US Patent Issued to Beijing E-Town Semiconductor Technology, Mattson Technology on July 28 for "Thermal processing of closed shape workpieces" (German, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,568, issued on July 28, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijng, China) and Mattson Technology Inc. (Fremont, Calif.).

"Thermal processing of closed shape workpieces" was invented by Rolf Bremensdorfer (Bibertal, Germany), Johannes Keppler (Dornstadt, Germany) and Michael Yang (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat...