US Patent Issued to Beijing BOE Technology Development on Oct. 27 for "High integration substrate integrated with passive device, and production method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,944, issued on Oct. 27, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing).

"High integration substrate integrated with passive device, and production method therefor" was invented by Yingwei Liu (Beijing), Ke Wang (Beijing), Zhanfeng Cao (Beijing), Qi Yao (Beijing), Guangcai Yuan (Beijing), Yuelei Xiao (Beijing) and Yue Li (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a base plate integrating passive devices and a method for manufacturing the same, which relate to the technical field of radio frequency devices. The base plate integrating passive devices of the present disclosure includes ...