US Patent Issued to BEIJING BOE TECHNOLOGY DEVELOPMENT, BOE TECHNOLOGY GROUP on March 3 for "Haptic feedback module and haptic feedback device" (Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,506, issued on March 3, was assigned to BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Haptic feedback module and haptic feedback device" was invented by Yongchun Tao (Beijing), Dexing Qi (Beijing), Zhihui Chen (Beijing), Jiawen Zhang (Beijing) and Yingzi Wang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A haptic feedback module and a haptic feedback device relate to the technical field of electronics. The haptic feedback module includes: a touch control module having a touch control face; a bottom plate disposed on one side of the touch control module facing away from the touch control...