US Patent Issued to Bank of America on Aug. 4 for "Laplace noise enabled encapsulation for smart bi-directional dual node hashchain based remodeled data clean room bundles" (Indian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,999, issued on Aug. 4, was assigned to Bank of America Corp. (Charlotte, N.C.).

"Laplace noise enabled encapsulation for smart bi-directional dual node hashchain based remodeled data clean room bundles" was invented by Sakshi Bakshi (New Delhi), Sneha Padiyar (East Mumbai, India) and Hariharan Balakrishnan (Chennai, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods enhance data privacy and generate hash keys at identity nodes by processing partial metadata and linking these keys through identity graphs, ensuring no single node has the complete dataset. The method includes performing identity resolution, data anonymization, and ...