US Patent Issued to BANDAI on July 28 for "Electronic device cover and toy" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,691,384, issued on July 28, was assigned to BANDAI Co. LTD. (Tokyo).

"Electronic device cover and toy" was invented by Erika Yasuda (Tokyo), Yuri Okamoto (Tokyo) and Megumi Shiina (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device cover includes a first cover portion configured to cover at least a part of an electronic device, the first cover portion being attachable to and detachable from the electronic device. The first cover portion includes a first convex portion configured to fit into a first concave portion provided in the electronic device and a second convex portion configured to fit into a second concave portion provided...