US Patent Issued to Avago Technologies International Sales on June 9 for "Double side molded land grid array package platform using a substrate with copper posts" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,048, issued on June 9, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Double side molded land grid array package platform using a substrate with copper posts" was invented by Li Sun (San Jose, Calif.), Chang Kyu Choi (Fremont, Calif.) and Sarah Haney (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "DSM-LGA using substrates with different surface finish options include copper posts for electrical communication. The copper posts include a height-to-width ratio that cannot be achieved in traditional copper posts, as well as a taper ratio that forms a more rectangular cross section as opposed to traditional...