US Patent Issued to Avago Technologies International Sales on Aug. 18 for "Hybrid substrates and manufacturing methods thereof" (American, Singaporean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,953, issued on Aug. 18, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Hybrid substrates and manufacturing methods thereof" was invented by Mayank Mayukh (Fort Collins, Colo.), Shrikara Prabhu Tendel (Singapore), Jayanthi Pallinti (Los Gatos, Calif.) and Gregory Dix (Fort Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The subject technology is directed to semiconductor devices and manufacturing methods. In various embodiments, the subject technology provides a semiconductor device, which comprises a first circuit characterized by a first coefficient of thermal expansion (CTE) and a substrate characteriz...