US Patent Issued to AUTONETWORKS TECHNOLOGIES, SUMITOMO WIRING SYSTEMS, SUMITOMO ELECTRIC INDUSTRIES on May 12 for "Wiring module" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,996, issued on May 12, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYSTEMS LTD. (Mie, Japan) and SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Wiring module" was invented by Shuya Ikeda (Osaka, Japan), Osamu Nakayama (Osaka, Japan), Katsuhi Miyazaki (Osaka, Japan) and Mitsutoshi Morita (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring module is attached to a plurality of power storage elements and includes an FPC, a reinforcing plate attached to the FPC, and a protector for holding the FPC and the reinforcing plate. The FPC is electrically connected to electrode terminals of the plurality of p...