US Patent Issued to AUTONETWORKS TECHNOLOGIES, SUMITOMO WIRING SYSTEMS, SUMITOMO ELECTRIC INDUSTRIES on July 28 for "Device module" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,691,728, issued on July 28, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYSTEMS LTD. (Mie, Japan) and SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Device module" was invented by Tatsumi Sato (Osaka, Japan), Kosuke Sone (Osaka, Japan), Yasuyuki Yamamoto (Osaka, Japan), Takuya Taniguchi (Osaka, Japan) and Ai Takehisa (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aim is to provide a technique allowing a device to be cooled without being housed inside a duct. A device module includes: a support member that is disposed in a roof inner space that is located between a roof panel and an interior member i...