US Patent Issued to AUO on June 30 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,550, issued on June 30, was assigned to AUO Corp. (Hsin-Chu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Chun Chang (Hsin-Chu, Taiwan) and Hsia-Tsai Hsiao (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a redistribution structure, a first conductive portion, a second conductive portion and a third conductive portion. The redistribution structure includes a first conductive pad and a second conductive pad. The first conductive portion is electrically connected with the first conductive pad. The second conductive portion is electrically connected with the second conductive...