US Patent Issued to AUO on June 30 for "Method of transferring micro-LEDs on circuit substrates, removing support structure and grinding edge of circuit substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,405, issued on June 30, was assigned to AUO Corp. (Hsinchu, Taiwan).

"Method of transferring micro-LEDs on circuit substrates, removing support structure and grinding edge of circuit substrate" was invented by Yi-Hsin Lin (Hsinchu, Taiwan) and Wen-Lung Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A display panel includes a circuit substrate, a first supporting structure, a glue layer residue and light-emitting diodes. The circuit substrate has electrodes. The first supporting structure is located outside the electrodes on the circuit substrate. The glue layer residue is located on the first supporting structure. The light-emi...